| This message contains HTML formatting. If you don't see the content below, please use the following link to view online: http://www.fsi-intl.com/press/newsletter_0208/direct/0208_cant_e.htm |  | | February 2008 
| FSI in the News |
FSI International Announces Breakthrough in Metal Stripping for Silicide Formation FSI announced it has adapted its ViPR™ technology to successfully remove unreacted metal films after salicide formation. By implementing this new process, IC makers can achieve dramatic reductions in chemical usage and capital requirements for cobalt, nickel and nickel platinum silicide integration schemes. FSI ViPR™ technology is available on new FSI ZETA® Spray Cleaning System orders and as an upgrade to more recently installed systems in the field. more >> |
| Product Updates | | ZETA® Spray Cleaning System� ViPR™ Process for Metal Silicide Stripping Reduces Cost, Increases Throughput and Enables Low Temperature NiPtSi Anneal In parallel to the advancements made in ashless resist stripping using ZETA® system ViPR™ process, FSI now offers the HCl free ViPR™ process for metal silicide stripping. In collaboration with several customers, FSI has optimized the ViPR?baseline process for rapid stripping of cobalt and nickel-platinum alloy metals used for salicide formation. more >> ZETA® Spray Cleaning System� ViPR™ Process for Ashless Photoresist Stripping Reduces Material Loss and Chemical Costs While Improving Throughput IC manufacturers must continually seek ways to reduce their process costs while meeting or exceeding process performance requirements. In photoresist stripping, a primary performance requirement is the need to minimize material loss during the resist stripping process, and this need will grow in importance as implants become shallower at the 45nm and 32nm technology nodes. more >> FSI ANTARES® New Cryokinetic Cleaning System Handler Improves Throughput and Reduces Backside Particles New Edge Contact End Effectors (ECEE) and an Edge Grip Chuck (EGC) substantially reduce backside particulate contamination and improve the throughput of FSI� ANTARES® cryokinetic cleaning systems. The ITRS Surface Preparation Roadmap has identified backside particle control as a critical issue for IC manufacturing. Currently, the ITRS is projecting the need for less than 200 backside particles larger than 0.16 microns, decreasing to a particle size of 0.14 microns for future generations. The particle maps below show the back side particles detected for a standard vacuum chuck, the new EGC and the EGC with the ECEE. more >> FSI Receives U.S. Patent Strengthening Its Intellectual Property Portfolio for Surface Tension Gradient (STG®) Technology The U.S. Patent and Trademark Office has awarded FSI a patent for a method which improves rinsing and drying microelectronic devices in immersion tanks for front-end-of-line (FEOL) critical cleans. This patent further strengthens and broadens FSI� patent portfolio in the area of surface tension gradient (STG®) rinse/dry process and provides IC makers with industry-leading rinse dry performance for 300mm FEOL critical cleaning at 65nm, 45nm, and future generations. The STG® process is currently used in the FSI MAGELLAN® immersion cleaning system. more >> |
| Customer Care News |
FSI Knowledge Services™ Seminar Series Returns to Europe and Israel in May 2008
Since 2004, well over 1000 IC manufacturers have attended FSI� popular Knowledge Services™ Seminar Series. This seminar series brings practical surface conditioning knowledge to IC manufacturers, while creating an opportunity for interaction and discussion. This spring� seminar in Europe and Israel will include presentations from FSI and IC manufacturers addressing the latest industry trends and implementation of surface preparation technology in IC processing. more >> FSI Account Management Support Continues to Grow in Asia with the Addition of Technical Sales Managers Leo Xu and Tam Chan FSI is very pleased to welcome Leo Xu to FSI as Technical Sales Manager for Greater China and Tam Chan as Technical Sales Manager for Taiwan. more >> Apprecia Technology� Kenichi Itoi receives award for FSI Advanced Cu/Low-K Cleaning Paper at SEMICON Japan 2007 SEMI announced that Apprecia Technology� Kenichi Itoi, business coordinator for FSI International products, received the STS (SEMI Technology Symposium) 2007 award for presenting the paper �ryogenic Aerosol Technology for Advanced Cu/Low-k Cleaning" during SEMICON Japan 2007. more >> FSI Presents on the Financial Benefits of All-Wet Photoresist Removal for 200mm in Wuxi, China At the November 2007 China IC Industry Development Conference in Wuxi, China, James Chu, FSI field application engineering manager for SE Asia and Great China presented the "The Financial Benefits of All Wet Photoresist Removal for 200mm." more >> FSI Presents Papers on Yield Improvement Using Cryogenic Aerosol for BEOL Defect Removal and Wet Resist Strip Capability vs. Implant Energy at ECS FSI presented at the 10th International Symposium on Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing at the October 2007, Electrochemical Society Meeting in Washington, D.C. more >> FSI Presents the Advantages of Batch Spray Processing for Superior All-Wet Photoresist Stripping and Film Removal in China and Korea "Batch Spray processing for Superior Photoresist Stripping and Film Removal process" was presented at the August 2007 SI China Wafer Cleaning Seminar in Shanghai, China, by James Chu, FSI field application engineering manager for SE Asia and Great China; and at the September 2007, 6th Korean Surface Cleaning Users Group meeting in Seoul, Korea, by Andy Lee, FSI spray applications section manager. more >> |
| New Publications | | FEOL Post-Ash Clean and Photoresist Strip
"Wet Resist Strip Capability vs. Implant Energy," by Kurt K. Christenson, FSI International, presented at the 212th ECS Meeting, October 2007 
BEOL Particle Removal
"Yield Improvement Using Cryogenic Aerosol for BEOL Defect Removal," by Jeffrey M. Lauerhaas and Yav San Kok, FSI International; and Ameer Hamzah and Ling Tze Tan, Chartered Semiconductor Manfacturing Ltd., presented at the 212th ECS Meeting, October 2007
Please visit the FSI Technical Library to view the latest papers available on FSI technologies
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| Looking Ahead |
Euro Knowledge Services™ Seminar Series
FSI will be holding its next Knowledge Services™ Seminar Series in Europe during the month of May 2008. To receive complete agenda, venue and registration information on these upcoming seminars, go to KSS EMEA
FSI is an Executive Sponsor of the 2008 SEMATECH Surface Preparation and Cleaning Conference on "Emerging Technologies in Semiconductor Surface Preparation"
March 31 - April 2, 2008, Sheraton Austin Hotel, Austin, Texas Dr. Jeff Butterbaugh, FSI International chief technologist and ITRS FEP co-chair, will give an invited presentation entitled "ITRS 2007 Front End Processes ?The End of Traditional Transistor Scaling ?The Beginning of New Materials and New Structures" more >> |
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