The AMD 700 chipset series (also called as AMD 7-Series Chipsets) is a set of current and upcoming chipsets designed by ATI for AMD Phenom processors to be sold under the AMD brand. Several members were launched in the end of 2007 and the first half of 2008, others launched throughout the rest of 2008.
The existence of the chipsets was proven on October 2006 through two hardware websites in Chile [2] and Spain [3] which posted the leaked slides of an ATI internal event, "ATI chipset update". In the slides, ATI has shown a series of RD700 series chipset logics. Codenamed RD790, RX790, RS780 and RS740 respectively. A codenamed SB700 southbridge was also mentioned in the event. The 790X (codenamed RD780) chipset was spotted in Computex 2007, exhibited by ASUS [4], while the SB750 southbridge was reported by VR-Zone [5]. The RS780D was first reported by HKEPC [6] while the RX780H was first seen on ECS internal presentations. [7]
After the acquisition of ATI Technologies, AMD started to participate in the development of the chipset series. And as a result, the first performance and enthusiast segment chipsets products under the AMD brand, The 790FX, 790X and 770 chipsets were launched on November 19, 2007 as part of the Spider codenamed desktop performance platform. The 780 chipset series, first launched in China on January 23, 2008, and released worldwide on March 5, 2008 during CeBIT 2008 [8], mobile chipsets (M740G, M780G and M780T chipsets) were released on June 4, 2008 during Computex 2008 as part of the Puma mobile platform and the 790GX chipset was released on August 6, 2008, while some other members released at a later date in 2008.
790FX
- Codenamed RD790, final name revealed to be "AMD 790FX chipset" [9]
- Dual-socket (Quad FX, Dual Socket Direct Connect (DSDC) Architecture) or single AMD processor configuration
- Maximum four physical PCI-E x16 slots and discrete PCI-E x4 slot [10], the chipset provides a total of 42 lanes solely in the Northbridge
- HyperTransport 3.0 with support for HTX slots [10] and PCI Express 2.0
- ATI CrossFire X
- AutoXpress
- AMD OverDrive
- Energy efficient Northbridge design
- Extreme overclocking, reported to have achieved about 420 MHz bus for overclocking an Athlon 64 FX-62 processor [11], from originally 200 MHz.
- Optional discrete chipset cache memory of at least 16 KB to reduce the latencies and increase the bandwidth [10]
- Supports Dual Gigabit Ethernet, and teaming option [10]
- Reference board codenamed "Wahoo" [12] for dual-processor system reference design board with three physical PCI-E x16 slots, and "HammerHead" for single-socket system reference design board with four physical PCI-E x16 slots, also notable was the reference boards includes two ATA ports and only four SATA 3.0 Gbit/s ports (as being paired with SB600 southbridge).
- Will pair with SB750 southbridge with support up to six SATA ports and enhanced Phenom processors overclocking via ACC functionality, and will later support Socket AM3 with DDR3 SDRAM support in the first quarter of 2009.
- Enthusiast discrete multi-graphics segment
790X
- Codenamed RD780, final name revealed to be "AMD 790X chipset" [13]
- Single AMD processor configuration
- Two physical PCI-E x16 slots (one 16x and one 8x electrically. In Crossfire mode, both will revert to 8x electrically)
- HyperTransport 3.0 and PCI Express 2.0
- ATI CrossFire
- AutoXpress
- AMD OverDrive
- Energy efficient Northbridge design
- Mobile version (codenamed RD780M) planned, supporting CrossFire for two AXIOM/MXM discrete mobile GPUs [14]
- Can pair with SB750 southbridge with support up to six SATA ports and enhanced Phenom processors overclocking via ACC functionality.
- Supports Socket AM3 with DDR3 SDRAM depending on motherboard BIOS
- Performance discrete multi-graphics segment
790GX
- Codenamed RS780D [6], final name seen on internal AMD presentation [15]
- Single AMD processor configuration
- Integrated graphics: Radeon HD 3300 [16]
- ATI Hybrid Graphics
- Side-port memory as local frame buffer [17], supporting DDR2 and GDDR3 modules. [18]
- ATI PowerPlay technology
- Two physical PCI-E x16 slots at x8 bandwidth [6]
- HyperTransport 3.0 and PCI Express 2.0
- ATI CrossFire
- AMD OverDrive
- Energy efficient Northbridge design
- 55 nm CMOS fabrication process manufactured by TSMC
- 528-pin Flip Chip Ball Grid Array (FCBGA) package
- Performance hybrid multi-graphics segment
780G/780V
- Codenamed RS780, value version codenamed RS780C
- Single AMD processor configuration
- Integrated graphics: Radeon HD 3200 (780G) [16], Radeon 3100 (780V) [19]
- 205 million transistors [20]
- ATI Hybrid Graphics and PowerXpress (780G only, PowerXpress for M780G only)
- Side-port memory as local frame buffer [17], supporting DDR2 and GDDR3 modules [18] (780G only)
- ATI PowerPlay technology
- UVD (780G only)
- One physical PCI-E x16 slot
- HyperTransport 3.0 and PCI Express 2.0
- AMD OverDrive
- Energy efficient Northbridge design
- "Remote IT" (temporary name, 780V only)
- Pin-to-Pin compatible to RS690 [22]
- Reference board design codenamed "Seahorse" [12]
- Mobile version (M780G, codenamed RS780M) demonstrated in May 2007 [23], and will be available during second or third quarter (Q2-Q3) 2008 [24], with the implementation of PowerXpress technology, providing one PCI-E slot for AXIOM/MXM modules [25] and HyperFlash [26][27] support for the Puma platform
- Mainstream hybrid graphics (DirectX 10 IGP) segment (780G), value and commercial DirectX 10 IGP segment (780V)
780E
- Codenamed RS780E
- Single AMD processor configuration
- Integrated graphics: Radeon HD 3200
- 205 million transistors [20]
- ATI Hybrid Graphics and PowerXpress
- Side-port memory: 128 MB GDDR3
- ATI PowerPlay technology
- UVD 2
- One x16 or two x8 PCI-E x16 slot (physical x16 slot)
- HyperTransport 3.0 and PCI Express 2.0
- ATI CrossFire
- AMD OverDrive
- Energy efficient Northbridge design
- Reference development board design codenamed "Mahogany"
- High-end embedded systems segment
RX780H
- Codenamed RX780H [7]
- Single AMD processor configuration
- DirectX 10 accelerator [28]
- Without display output [29]
- ATI Hybrid Graphics
- Energy efficient Northbridge design
- Performance hybrid graphics segment
770
- Codenamed RX780 [30], final product name revealed by ECS [31]
- Single AMD processor configuration
- One physical PCI-E x16 slot
- HyperTransport 3.0 and PCI Express 2.0
- AutoXpress
- Energy efficient Northbridge design
- Mobile version (M780T), supports discrete graphics, and support for "add-on" graphics solution, via external PCI-E cabling [32]
- Mainstream discrete single-graphics segment
760G
- Single AMD processor configuration
- Integrated graphics
- 55 nm CMOS fabrication process manufactured by TSMC
- ATI PowerPlay technology
- ATI Hybrid Graphics
- HyperTransport 3.0 and PCI Express 2.0
- Value DirectX 10.0 IGP segment
740G
- Codenamed RS740, value version codenamed RS740C
- Single AMD processor configuration
- Rename from the AMD 690G chipset
- Integrated graphics: Radeon 2100 [19]
- 55 nm CMOS fabrication process manufactured by TSMC
- Side-port memory as local frame buffer as implemented in the M690T chipset, supporting DDR2 and GDDR3 modules. (740G only)[citation needed]
- ATI PowerPlay technology
- One physical PCI-E x16 slot and one PCI-E x4 slot
- HyperTransport 1.0 and PCI Express 1.1a
- Pin-to-pin compatible to RS690C
- Mobile version (M740G, codenamed RS740M) available
- Value DirectX 9.0 IGP segment
740
- Codenamed RX740 [33]
- Single AMD processor configuration
- One physical PCI-E x16 slot
- HyperTransport 2.0 and PCI Express 1.1a
- Energy efficient Northbridge design
- Value discrete single-graphics segment
Southbridges
Besides the use of SB600 southbridge for earlier releases of several members in late 2007, all of the above chipsets can also utilize newer southbridge designs, the SB700, SB710 and the SB750 southbridges. Future server chipsets will also utilize the server version (SB700S/SB750S) of the southbridges. Features provided by the southbridge are listed as follows:
[edit] SB700
- Support up to 6 SATA 3.0 Gbit/s hard disk drives, with RAID 0, 1, 10 support
- eSATA support
- No support for IDE/PATA[34]
- Support up to 14 USB ports (12 USB 2.0 and 2 USB 1.1)
- I/O acceleration technologies
- Consumer Infrared receiver/transmitter port compatible with IrDA standards [35]
- Additional management and security technologies such as IDM (Intelligent Device Management) and TPM (Trusted Platform Module). [36]
- DASH 1.0 support
[edit] SB710
- All features from SB700
- Super I/O
- Advanced Clock Calibration for enhanced CPU overclocking
- Direct communication channel composed of six data pins which were previously reserved between the CPU and the southbridge
- Advanced Clock Calibration (Option available with AMD OverDrive software 2.1.1 and later)
- Increase CPU overclocking potential via altering internal settings
- Allow separate settings for each of the CPU cores
- Allowed range: -12% to +12% with ACC enabled
[edit] SB750
- All features of SB700
- RAID 5 support [5]
- Super I/O
- Enhanced CPU overclocking for K10-based processors only, originally named "OverDrive 3.0" [37]
- Direct communication channel composed of six data pins which were previously reserved between the CPU and the southbridge
- Advanced Clock Calibration (Option available with AMD OverDrive software 2.1.1 and later)
- Increase CPU overclocking potential via altering internal settings
- Allow separate settings for each of the CPU cores
- Allowed range: -12% to +12% with ACC enabled
[edit] SP5100
- All features of SB700
- Super I/O
- Target for future server chipsets [19]
- Originally named SB700S ,[38] later renamed as SP5100. [39]
[edit] SB750S
- All features of SB750
- Super I/O
- Target for future server chipsets [19]
Ref
http://en.wikipedia.org/wiki/AMD_700_chipset_series
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整合平台780G/790GX��合壁
之前AMD平台的落魄，主板�� 面上的欠缺，在一定程度上也成�了其中的制�因素。如今，AMD主板��的�富程度�然�不能�是��INTEL，但是就是整合主板�一部分，AMD主板 在市�上所�得的成�十分喜人。且不�已�售�以低廉著�的MCP78，光是AMD�大整合主力780G和790GX，就能�以集中市�上足�多的�注 度。
一直以�，AMD 780G和790GX芯片�所“�以成名”的就是其所集成的�示核心，�建了UVD高清解�引擎，能�支持DVI以及HDMI高清�示接口，�高清回放� 用得到更充足的硬件特性支持，加之其基��示核心性能�不弱，因而它�就受到了入��和中低端玩家的�度推崇。而790GX更是在780G的基�上，提升 了�示核心的核心�率，追加了�混合交火等�示增�技�的支持，而且�有相�部分的�品�整合了64M-128M的�立�存，�一步�解�示核心�系�� 存的依�，�平台的�示性能得到了更�一步的提升。�然，相�于INTEL的G31、G41等整合芯片�，780G和790GX所能迎合的群�更�，而� 者��相扣的市�格局，更是�用��感受到“��由人”的�心。
而更�喜人的是，780G和790GX主板正�于�格的�定期，技�的成熟，市售一二��商的��支持，�都是�予消�者最直接的信心。要知道，�在 399－499元��的780G，499－599元��的790GX，�售相��火，更有甚至直接用780G/790GX主板搭��立�卡，�成一�有� 另�搭配，足���一��品在市�上的人�度。�的��，AMD不但塑造了�款��整合主板的光�形象，而更重要的是AMD���款�品�予了合理的� 格，��造出良好的市�格局和�境，�它�能���出“1＋1大于2”的出�推�效果，既然整合��能��得如此成�，那��于非整合��的770、 790FX等�品，我�也就理��有同�的期待。
SB750南�全面��，��之中�功力
�然��去的SB600、SB700，�渡到�前的 SB750，�然同一系列主板在北�芯片�功能、��配置上�化�不大，但是�些��上的提升，就能��示出新一代AMD平台的功力。在很多DIY玩家的 印象�中，AMD平台里面可供��的主板，�外乎就是那��款，包括像MCP78、780G、790GX、770、790FX等等，相信大家也已�耳熟能 �，看起�也不�有什��喜的�生。然而，AMD�商近期就�自己的自家�品追加的���而不�的新元素：不少770、790FX主板都改用上了 SB750南�芯片，加上一直以�都是沿用著SB750的790GX主板，�然，�一新的南�已�全面��AMD主流平台。
不�SB750的加入，的�是���上�予了整�AMD平台以一支�心�。相�于老式的SB600和�用面依然相���的SB700，SB750首先增 加了SATAII、USB接口的�量，在磁��列上除了RAID 0/1/10三�模式，�加入了RAID 5模式，��意�用多硬��成磁��列系�的用��用起�更�便利。此外，SB750南�集成了��控制器，支持高���校准ACC 超�加速技�，特��化Phenom�理器的性能，尤其是��一些黑盒版本的CPU�品的超�，其��的超�表�更是超越普通A770和780G主板。
搭�SB750南�的770/790X/790FX主板大量��
SB750的逐步普及看起��是全方位的，�中低端的AMD 770芯片�，�入���核平台用�也能�����自AMD�微�化所��的�步，然而到中高端的790FX芯片�，�竟目前45nm Phenom II系列CPU已��7、8、9系列的�品�逐步完善，�些代表著未�AMD平台�展方向的�理器�品，在得到了SB750的�力支持以後，必然更能有效 地��出其自身的�良特性，��一些��滴滴的�透，正是在未�一段��里面，AMD�以�INTEL全面抗衡的�本。
平民主板加入AM3+DDR3行列，AMD�前景未雨��
�未�的一段�展前景看�，AMD的770和790GX芯片�，未��依然�是AMD平台的主流拳�主力，如今在AM2/AM2+/AM3�理器接口兼 容占主�的市��境下，770和790GX主板�然�有著一定的市�生存空�。不�，未�必然是AM3接口�理器＋DDR3�存的天下，因此如今已�有不 少�商所推出的�品，已�逐�有了�方面的�向，因此在770和790GX主板身上出�了AM3接口和DDR3�存的情�，自然也�不���人�分�� 了。
左��AM3接口，右��AM2/AM2+接口
�用AM3接口的AMD�理器已�逐步�得平民化，�45nm制程的Phenom II X3 710/720起步，到Phenom II X4 810以及X4 940/955等等，也都沿用了最新的AM3接口，�然�已��用了AM3接口的主板，已�不再兼容�去的AM2/AM2+接口�理器，但足�多的�理器 ��，��些AM3主板�不�找到伙伴，而且��的做法，���的角度去看更是有利于AM3架�未�的普及。
然而，更值得用��心的��是DDR3�存的加入，�目前的��看�，DDR3�存尚未�到市�成熟的地步，�管它�在售�上已�一步一步地拉近�主流 DDR2�存的差距（�前一些普及型的2G DDR3 1333售�也是200元出�），但是一些低�DDR3�存在延�等方面的劣�依然�有解�，其受�迎和普及程度依然不及DDR2，而且更多���玩家更 �意��一些超�型的DDR2�品，因此在�一方面，770/790GX芯片�也往DDR3的方向上靠�，�一定的程度看�，也���人�得有一��的超 前了。
客�地�，�AM2/AM2+�渡到AM3，�DDR2�渡到DDR3，��的一些�革，瞄准了���是未�平台�展的正�方 向，�可以看作是�去第一代羿�平台的一�修正，在��新��代�品共存的�期，是必然存在的一�元素，未�的AMD主流平台�向�大，�前�一��的改 良��，都可以�作是一�有效的�累。
7系芯片组支持AM2 处理器接口，现在AMD推出了770/790X/790FX三款芯片组，其中770是入门级别产品，定位DIY游戏玩家，官方版本并未提供CrossFire的支持，而790X和790FX则分别提供了CrossFire和CrossFire四卡的支持。
初见升技AX78还并未认出是770芯片组，其两个PCI-E 16x显卡插槽比较具有欺骗性，其实是升技方面对770芯片组进行了破解，使其完成了对交叉火力系统的支持，实际上已经和其主流级别产品790X站在同一条线上。
AMD的7系列芯片组已经发布一年有多，在市场上在AMD的3A平台攻势下AMD芯片组已经获得了不少的市场份额，而更重要的是类似Intel的自家CPU加之家芯片组的策略使得第三方芯片组的市场不断萎缩。AMD 7系列芯片组以集成显卡的780G和790GX最为人知，已经这两款芯片组都集成了HD3000系列的显卡提供出色的3D系统同时更支持UVD高清视频解码功能。而对于独立显卡市场AMD的芯片同时也覆盖了高中低三方，AMD以770芯片组主攻低端市场，以790X主攻主流市场，790FX主攻高端市场。在市场上770和790FX的主板都比较常见，但是790X主板则非常少，主要是受到790GX芯片组的影响，由于790GX的价格非常大众化，使得主流用户选择790GX也不去选择790X。对于AMD的非集成平台的芯片组之间的差别有多大？我们特意做了一个AMD 7系列芯片组性能对比测试：
点击图片直接进入测试部分
下面我们首先来了解一下AMD现时在市场上热销的非集成芯片组：
AMD北桥：
2007年12月，AMD发布了7系独立平台芯片组，三款从市场定位上被分为发烧级、性能级以及主流级三个级别。他们分别是790FX、790X以及770，全部采用65nm制程工艺。并且对都对AMD 自家的3A平台有优化。AMD 790FX芯片组是整个独立芯片组平台中的最高端型号，790FX芯片组由RD790北桥芯片和SB600南桥芯片组成，拥有最优秀的周边扩展性能，能够对CrossfireX四路交叉火力提供强力支持（支持双PCI-E 16x显卡互联，或是4x PCI-E 8X显卡互联），为AMD 3A平台上芯片组的领军产品，使注重系统运行流畅性的高端用户的不二之选。
AMD 790X 芯片组由RD780北桥芯片和SB6000南桥芯片所组成。相比于高端的790FX芯片组，790X 芯片组在PCI-E 2.0通道数量上有所缩减，但仍然支持Crossfire 2路交叉火力（支持PCI-E 16X + PCI-E 8X的双显卡交火配置，或双PCI-E 8X显卡+PCI-E 8X物理加速卡的配置），790X 芯片组主要面向性能级中端用户，简约、务实、高效是它最大的特点。因此，为了服务用户群，市面上的790X主板也大都走实用主义路线，以尽量发挥出平台性能为主导。 AMD 770芯片组由RD770北桥芯片和SB600南桥芯片所组成，是一款面向中低端市场的独立芯片组型号，定位与AMD入门级独立显卡相呼应。AMD 770芯片组官方不支持Crossfire 技术，但是有不少厂商以及破解支持这项技术。值得一提的是AMD 的7系列独立芯片组首次采用65nm制程工艺，先进的工艺带来了更低的发热量与功耗，其TDP的功耗仅仅是10W左右，节约了芯片组的功耗，将更多的能量转化到处理器和显卡方面，更好的提升整个平台的性能。虽然与780G与790GX的55nm有差距，但对于独立平台的发热量来说已属领先。
简言之，三款7系独立芯片组从产品本身支持的技术上来看差距并不大，最大的区别是在显卡的支持上，最高端的790FX支持ATI最新的Crossfire X技术，可以支持4块显卡并联组成Quad CF系统；而中高端的790X可以支持两块PCI-E 2.0显卡，以方便用户组件双卡Crossfire系统；而针对主流市场的770则只有一个PCI-E x16接口，不能支持CF。在支持性能方面和支持CPU方面并无不同。
790FX支持四卡交火Crossfire X技术
AMD7系芯片组还有一个非常优秀的特性，就是对AMD CPU 兼容性极佳。一款主板硬件上无需任何改动一般可以兼容两种接口的CPU，如AM2+接口的主板可以兼容到AM3的CPU。虽然这会损失一定的性能。
为了让大家更好的比较各款芯片组的规格，我们总结了如下这个表格以供参考：
